From microarchitecture through GDS delivery, our teams cover the complete ASIC and SoC implementation flow — engaged individually or as a fully integrated program.
Microarchitecture through synthesizable RTL, ready for verification — including low-power RTL, lint, CDC and RDC checks.
Get in TouchUVM-based testbenches, assertions and coverage-driven signoff, backed by automated regression.
Get in TouchFloorplanning, power planning, placement, CTS and routing, carried through ECO to timing closure.
Get in TouchConstraint development and multi-corner MMMC analysis, validated through ECO to signoff-ready timing.
Get in TouchDRC, LVS, ERC, antenna and density checks with metal fill — clean before tapeout.
Get in TouchScan insertion, ATPG, MBIST and LBIST with compression, for manufacturing-ready silicon.
Get in TouchFinal signoff, release management and GDS delivery — ready for the fab.
Get in TouchMicroarchitecture, RTL coding and UVM-based functional verification to a clean, coverage-signed-off netlist.
Scan/ATPG insertion alongside constraint development and multi-corner static timing analysis.
Floorplan, power planning, placement, CTS, routing and ECO through timing closure.
Physical verification, final signoff, release management and GDS delivery.