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Seven disciplines, one silicon signoff.

From microarchitecture through GDS delivery, our teams cover the complete ASIC and SoC implementation flow — engaged individually or as a fully integrated program.

Every stage, one accountable team.

From microarchitecture to GDS delivery, EdgeSilica engineers plug directly into your flow with signoff-grade tooling and clear ownership at every handoff.

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OUR SERVICES

Seven disciplines, fully detailed.

RTL Design

Microarchitecture through synthesizable RTL, ready for verification — including low-power RTL, lint, CDC and RDC checks.

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Functional Verification

UVM-based testbenches, assertions and coverage-driven signoff, backed by automated regression.

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Physical Design

Floorplanning, power planning, placement, CTS and routing, carried through ECO to timing closure.

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Static Timing Analysis

Constraint development and multi-corner MMMC analysis, validated through ECO to signoff-ready timing.

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Physical Verification

DRC, LVS, ERC, antenna and density checks with metal fill — clean before tapeout.

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Design for Test (DFT)

Scan insertion, ATPG, MBIST and LBIST with compression, for manufacturing-ready silicon.

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Tapeout Support

Final signoff, release management and GDS delivery — ready for the fab.

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FLOW

How a program moves through our teams.

RTL & Verification

Microarchitecture, RTL coding and UVM-based functional verification to a clean, coverage-signed-off netlist.

DFT & Timing

Scan/ATPG insertion alongside constraint development and multi-corner static timing analysis.

Physical Design

Floorplan, power planning, placement, CTS, routing and ECO through timing closure.

Signoff & Tapeout

Physical verification, final signoff, release management and GDS delivery.

Tell us which stage your program is at — we’ll take it from there.

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